KUALA LUMPUR: JF Technology Bhd (JTB) is optimistic about the company's long-term prospects and is ready to ride on the recovery in the semiconductor industry.
Managing director Datuk Foong Wei Kuong said FY23 was demanding, given the intensified market uncertainties stemming from various macroeconomic obstacles.
"Therefore, it was a commendable achievement that we were able to equal the best-ever top-line performance posted in the previous year.
"This is credited to our highly sustainable and resilient business model with recurring and compounding sales of test consumables combined with the maturation of our growth engines," he said after the company's 17th annual general meeting today.
He said the company focuses on its six growth engines and the JF 4.0 transformation.
As part of this transformation, JTB has recently set up a joint venture company in Malaysia with Shenzhen HFC Co Ltd (Shenzhen HFC) to produce materials used in high-end semiconductor chips for artificial intelligence (AI) and electric vehicle (EV) applications.
Shenzhen HFC stands at the forefront of utilising graphene materials for heat dissipation in AI chips.
Therefore, being the leader in the material science of graphene for this application may lead to industry dominance, Foong said.
JTB is a main market-listed manufacturer of high-performance test contacting solutions for global integrated circuit (IC) makers.
On dividend payout, JTB has paid a total dividend of 1.0 sen per share, amounting to RM9.3 million in FY23.
This translated to a 76.2 per cent payout based on a net profit of RM12.2 million.
